Hanmi Semiconductor (042700)
Hanmi Semiconductor (042700) is a KOSPI-listed Korean equipment maker best known for the thermo-compression bonders that stack DRAM into high-bandwidth memory. In ETFpedia it represents the Korea manufacturing theme as a concentrated, high-beta play on the HBM supply chain that feeds AI accelerators, for better and for worse.
| Ticker | 042700 |
|---|---|
| Exchange | KOSPI |
| Sector | Semiconductors · HBM Back-End Equipment |
| Country | South Korea |
| Wikidata | Q131188043 |
| Last updated | 2026-06-04 |
Next event:Next report · H1 2026 반기보고서, estimated · Estimated from Korea's 45-day semi-annual filing deadline; not company-confirmed. Last report: Q1 2026 분기보고서 filed 2026-05-15. (source)
Latest reported quarter:Q1 2026 (ended Mar 31, 2026) (reported2026-05-15)
Hanmi Semiconductor's Q1 2026 revenue fell 65% year over year to ₩50.9 billion (₩509억) as HBM equipment orders cooled and SK Hynix moved to dual-source TC bonders; operating profit dropped 88% to ₩8.5 billion (₩85억), though net income of ₩19.0 billion (₩190억) held up better.
| Revenue | ₩509억 (KRW 50.9B)-65%YoY |
|---|---|
| Operating profit | ₩85억 (KRW 8.5B)-88%YoY |
| Net income | ₩190억 (KRW 19.0B)-65%YoY |
Recent & upcoming events
- · FY2025 사업보고서 filed.Full-year 2025 revenue ₩5,767억 (KRW 576.7B, +3% YoY) with operating profit of ₩2,514억 (KRW 251.4B, -2% YoY) and net income of ₩2,140억 (KRW 214.0B, +40% YoY). (source)
- · Q1 2026 분기보고서 filed.Revenue fell 65% YoY to ₩509억 as the HBM equipment order cycle softened and SK Hynix adopted a dual-sourcing strategy for TC bonders. (source)
Figures are consolidated (연결) per Hanmi Semiconductor's DART filings. Quarterly results for an equipment maker are lumpy and driven by HBM customers' capex timing.
Figures are as of 2026-05-15 and reflect the most recent public filings/IR releases; they are updated after each earnings report.
What does Hanmi Semiconductor do?
Hanmi Semiconductor builds back-end semiconductor assembly equipment. Its signature machine is the thermo-compression (TC) bonder, which uses heat and pressure to stack DRAM dies into the high-bandwidth memory (HBM) that sits beside AI accelerators. The company also makes micro-sawing systems, vision placement equipment, EMI-shield gear, and laser marking and cutting tools used across chip packaging. For years it was the exclusive TC bonder supplier to SK Hynix, and it has shipped large bonder orders to Micron as well (DigiTimes). That makes Hanmi one of the most direct equipment exposures to HBM, the memory whose demand the AI buildout depends on.
TC bonders “stack chips onto processed wafers by employing thermal compression to bond and play a crucial role in HBM yields.”
Why is Hanmi Semiconductor a Korea manufacturing company?
Hanmi is a pure-play Korean capital-equipment maker bolted directly onto the advanced-packaging step of the memory chain. It does not design chips, it builds the machines that turn DRAM into HBM, so it is a concentrated way to express Korea’s position in advanced semiconductor manufacturing, a cornerstone of the Korea manufacturing theme. The flip side of that concentration is cyclicality: a single customer’s capex decision can swing a quarter, which is exactly what played out in early 2026.
What did Hanmi Semiconductor report most recently?
In Q1 2026 (the quarter ended March 31, 2026), Hanmi posted revenue of ₩509억 (about KRW 50.9 billion), down 65% year over year, with operating profit of ₩85억 (down 88%) and net income of ₩190억 (down 65%) (DART 분기보고서). The drop is large and worth stating plainly: it reflects soft HBM equipment ordering at the start of 2026 and SK Hynix’s move to dual-source TC bonders away from Hanmi’s former exclusivity, which has pressured both volume and pricing (TrendForce). It also sits against a strong comparison base: full-year 2025 revenue was ₩5,767억 (about KRW 576.7 billion, +3% YoY) with operating profit of ₩2,514억 (-2% YoY) and net income of ₩2,140억 (+40% YoY) (DART 사업보고서).
What are the risks for Hanmi Semiconductor?
- Customer concentration. A handful of HBM makers (SK Hynix, Micron) drive most demand, so one customer’s capex pause can gut a quarter, as Q1 2026 showed.
- Loss of exclusivity. SK Hynix has moved to dual-source TC bonders, bringing in rivals like ASMPT and Hanwha Semitech, which threatens Hanmi’s share and pricing power (TrendForce).
- Cyclicality. Equipment revenue is lumpy and tied to the HBM capex cycle, which can swing sharply between quarters.
- Technology transitions. Each HBM generation (HBM3E to HBM4) reopens the bonder vendor decision, so design wins are never permanent.
Related securities, concepts & terms
- Korea Manufacturing Core Allianceparent
- SK Hynix (000660)related
Related indices & ETFs
- Akros Korea Manufacturing Index · AkrosKorean advanced-manufacturing index that includes this company.
Frequently asked questions about Hanmi Semiconductor
What does Hanmi Semiconductor do?
Hanmi Semiconductor builds back-end semiconductor equipment. Its flagship product is the thermo-compression (TC) bonder, a machine that stacks DRAM dies into high-bandwidth memory (HBM), the memory that sits next to AI accelerators. It also makes micro-sawing, vision placement, EMI-shield, and laser packaging systems. In FY2025 it posted revenue of ₩5,767억 (about KRW 576.7 billion) (DART 사업보고서).
Why is Hanmi Semiconductor part of the Korea manufacturing theme?
It is a pure-play Korean capital-equipment maker plugged directly into the HBM supply chain. SK Hynix and Micron use its TC bonders to assemble the HBM stacks that AI demand depends on, so Hanmi is a concentrated, high-beta way to express Korea's role in advanced semiconductor manufacturing. That same concentration cuts both ways, as the 65% Q1 2026 revenue drop shows (DART 분기보고서).
What was Hanmi Semiconductor's latest revenue?
In Q1 2026 (ended March 31, 2026) Hanmi Semiconductor reported revenue of ₩509억 (about KRW 50.9 billion), down 65% year over year, with operating profit of ₩85억 (down 88%) and net income of ₩190억 (DART 분기보고서). The sharp drop reflects soft HBM equipment ordering early in 2026 and SK Hynix's move to dual-source TC bonders, against a strong FY2025 base.
When does Hanmi Semiconductor next report earnings?
Korean issuers do not pre-announce earnings dates. Based on Korea's 45-day semi-annual filing deadline, the H1 2026 반기보고서 is expected around August 14, 2026; that date is estimated, not company-confirmed. Hanmi last filed its Q1 2026 분기보고서 on May 15, 2026 (DART).
Sources & references
- 한미반도체 분기보고서 (2026.03) · Hanmi Semiconductor / DART (Financial Supervisory Service), 2026-05-15
- 한미반도체 사업보고서 (2025.12) · Hanmi Semiconductor / DART (Financial Supervisory Service), 2026-03-12
- The TC Bonder Drama: Could Hanmi's Supply Shift the HBM Race Between Micron, SK hynix, and Samsung? · TrendForce, 2025-04-23
- SK hynix Reportedly Places HBM4 TC Bonder Order With ASMPT Amid Hanmi-Hanwha Patent Clash · TrendForce, 2025-12-12
- Hanmi Semiconductor's tough stance against SK Hynix supported by large TC bonder order from Micron · DigiTimes, 2025-04-21